Augsburg, Germany | June 28, 2017– Kontron, a leading global provider of Embedded Computing Technology (ECT), announces that it will merge with S&T Deutschland Holding AG. The merger had been resolved at both the Kontron Annual General Shareholder Meeting (AGM) as well as the AGM of S&T Deutschland Holding AG on June 19 and June 20 respectively.

After the merger, the brand “Kontron” continues to provide its customers with integrated solutions for embedded modules, boards and systems, Internet of Things (IoT) and Industry 4.0 applications. With more than 2,300 experienced engineers from both OT and IT backgrounds, Kontron together with S&T will offer additional innovative solutions for the seamless and secure connection of embedded systems into the Embedded Cloud.

Through S&T Group’s software know-how, Kontron will be able to extend its portfolio of software applications and services and, thus, consolidate its technological leadership position. Leveraging the Original Design Manufacturing Services (ODM) by Foxconn subsidiary Ennoconn Kontron will be able to fulfill even large delivery options moving forward. The extended product and services portfolio will help Kontron customers reduce time-to-market for products of their own significantly. The merger creates additional cost-saving opportunities and further simplifies the group’s organization. The new lean management structure will nurture more effective decision-making to shorten development times and evolutionary cycles.

In the beginning of 2017, Kontron restructured its regional areas of responsibility creating clear fields of competences and accountability of success. As the S&T Group is also organized on a regional level, Kontron customers only faced new reference contacts in very few exceptional cases after the merger. In association with S&T Group, Kontron regains a solid financial foundation facilitating future investment and innovation.

Together Kontron and S&T are committed to being technology and industry leaders in the ECT, IoT and Industry 4.0 markets. Both companies aim to achieve combined sales between EUR 860 and 890 million in fiscal year 2017, and plan to break the one billion Euro mark in revenues in 2018.

  • New Specification Replaces Earlier Military Documents for Straight and Right Angle Boots

Harrisburg, PA | January 13, 2015– TE Connectivity (TE), a world leader in connectivity, announces the successful completion and qualified product (QPL) status for its Raychem molded parts in accordance with SAE AS85049/140, /141 and /142, “Connector Accessories, Electrical Boots and Transitions, Heat Shrinkable.” This new specification replaces earlier military documents for straight and right angle boots, as defined in the previously popular MS3109 (straight) and MS3117 (right angle) specifications. Additionally, the new M85049 /142 specification includes Y and T transition shapes.

“TE’s Raychem heat-shrinkable molded parts have been the backbone of many sealed electrical interconnect systems for years,” said John Kuster, product manager, Global Aerospace, Defense & Marine, TE. “The SAE initiative gives a fresh look at these legacy materials and heat shrink products by replacing the typical color stripe with a ‘button’ coding insignia that is ink stamped on the parts. It appears in the form of a circle with the material code letter in its center.”

These new SAE-AS85049/14X specifications replace the drawings for the products that were specified in MS3109 and MS3117. The specific material properties are covered by specification AS81765 and SAE- AS5258, “Insulating Component, Molded, Electrical, Heat Shrinkable, Connector and Cable Accessory, Sealing Strain Relief, General Specification for.” Together, these two documents provide dimensional and material properties in updated formats.

Molded parts ordered to this new specification have the option of being purchased in six different material types, indicated by letter codes A, B, C, D, G and H. These letter designators represent standard Raychem materials that have been in the industry for over 50 years. Raychem molded parts are available with all specified options such as drain holes, vent ports, etc.

  • New plating is RoHS – Compliant Alternative to Cadmium Plating

Harrisburg, PA | September 9, 2014– TE Connectivity (TE), a world leader in connectivity, announces its new RoHS-compliant black zinc nickel plating for connectors and backshells. The new coating is TE’s response to new environmental regulations that seek to reduce the use of cadmium. The black zinc nickel plating is approved as defined by MIL-DTL-38999L, and offers the same level of electrical performance, harsh environment protection and temperature ranges as cadmium finishes.

“We’re pleased to be able to offer a solution helps our customers reduce cadmium usage and provides enhanced performance over similar products,” said Chris Novak, product manager, Global Aerospace, Defense & Marine, TE Connectivity. “And, because black zinc nickel and cadmium have similar electrical potential, new parts can be easily integrated into existing applications without additional engineering or excessive downtime.”

TE’s Raychem standard backshells can be supplied with the new RoHS compliant black zinc nickel plating and the bandstrap backshells are approved to the AS85049 specification for black zinc nickel with 1000-hour salt spray resistance testing.

Black zinc nickel finish is non-magnetic and non-reflective and ideal for a variety of applications including next-generation harsh-environment vehicles, electric drive vehicles, aerospace, mass transit, automotive, communications equipment, power generation and metering equipment.

The new plating option is available on TE’s DEUTSCH standard MIL-DTL-38999 Series III or DTS High Current connectors and Raychem standard backshells and accessories. For more information, visit http://www.te.com/en/about-te/news/new-products/2014/black-zinc-nickel.html or contact the Product Information Center at 1-800-522-6752.