TE Connectivity To Speak About Signal Integrity Challenges and Solutions at Embedded Tech Trends

• Forum Addresses Latest Developments In Signal Integrity
  in Rugged Interconnectors

Harrisburg, PA | January 20, 2014–  Matthew McAlonis, New Product Development Engineering Manager, Global Aerospace, Defense & Marine at TE Connectivity (TE), will present “The Rising Importance of Signal Integrity in High-Reliability Connectors” at the 2014 Embedded Tech Trends conference in Phoenix, Arizona on January 20, 2014.

The annual Embedded Tech Trends conference is an industry-wide forum, taking placeJanuary 20 and 21, where suppliers of components and board and system-level solutions meet exclusively with members of industry media to discuss technologies, trends and products. The theme for this year’s conference is “Advances in System Architectures.”

McAlonis will discuss how next-generation protocols with increasing data rates are driving embedded computing engineers to heavily scrutinize all aspects of their rugged system design. He will also address the latest developments regarding signal integrity in rugged connectors from TE.

“At TE Connectivity, we’re optimizing standard interconnects for the challenging high-speed, high-reliability market, addressing backplane, mezzanine and input/output applications for end-to-end connectivity assurance,” said McAlonis.

McAlonis is TE’s subject matter expert in high-speed rugged connectivity and PCB interconnects, compliant pin technology and VME/VPS system solutions. He is one of several other TE subject matter experts available to answer technical questions and connect with at www.DesignSmarterFaster.com.

For more information on the Embedded Tech Trends conference, visitwww.embeddedtechtrends.com.